US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,019, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Hongjin Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate, a controller chip on a first surface of the substrate, a first chip stack on the controller chip, a second chip stack on the substrate in adjacent spaced apart relationship with the first chip stack, a third chip stack including a first group of semiconductor chips above or below the first chip stack and a second group of semiconductor chips above or below the second chip stack. A buffer chip...