ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,954, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including variable resi... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,955, issued on June 23, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with filling layer and meth... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,956, issued on June 23, was assigned to Intel Corp. (Santa Clara, Calif.). "Incorporation of superlattice semi-metals for scaled interconne... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,957, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Anti-fuse cells with backside power... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,958, issued on June 23, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Flexible wiring architecture for multi-die i... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,959, issued on June 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method for forming semiconducto... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,960, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Metal-insulator-silicide capacitors... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,961, issued on June 23, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Heater elements" was invented by Uppili S. Raghunathan (E... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,962, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor ... Read More
ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,963, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "IC package with dummy die heat spreader" was... Read More