US Patent Issued to Mitsubishi Electric on June 23 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,962, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Katsuhiko Kondo (Tokyo) and Takuya Shiratsuru (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor device capable of reducing damage on a resin case by heating during manufacture and a method of manufacturing a semiconductor device capable of reducing damage on a resin case by heating during manufacture. A semiconductor device includes a base plate, an insulating substrate, a semiconductor element, and a resin case. The base plate includes first and second reg...