US Patent Issued to International Business Machines on June 23 for "Flexible wiring architecture for multi-die integration" (New York Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,958, issued on June 23, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Flexible wiring architecture for multi-die integration" was invented by Tao Li (Slingerlands, N.Y.), Ruilong Xie (Niskayuna, N.Y.) and Chih-Chao Yang (Glenmont, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a power distribution structure disposed on a first wafer, an interconnect structure disposed on the first wafer and a second wafer, and at least one decoupling capacitor connected between the power distribution structure and the interconnect structure."

The patent was filed on Sept. 20, 2022, under Application N...