ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,963, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"IC package with dummy die heat spreader" was invented by Jin-Woo Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to embodiments of the present disclosure, a semiconductor package is provided and may include: a substrate; a semiconductor chip on the substrate; a dummy chip on the semiconductor chip; and a first protection layer between the semiconductor chip and the dummy chip. The dummy chip may include: a semiconductor substrate including a first surface and a second surface, opposite to the first surface, the first su...