ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,173, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan). "Electronic package and shielding par... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,174, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "RFSOI semiconductor structures incl... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,175, issued on July 14, was assigned to Teledyne e2v Semiconductors SAS (Saint Egreve, France). "Flip-chip ball grid array-type integrated ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,176, issued on July 14, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Radio-frequency module and communication device... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,177, issued on July 14, was assigned to DB HiTek Co. Ltd. (Bucheon-si, South Korea). "RF switch device and method of manufacturing same" wa... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,178, issued on July 14, was assigned to Semiconductor Manufacturing International (Beijing) Corp. (Beijing) and Semiconductor Manufacturing ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,179, issued on July 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor package and method for marking ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,180, issued on July 14, was assigned to LAPIS TECHNOLOGY Co. LTD. (Yokohama, Japan). "Semiconductor device and manufacturing method of semi... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,181, issued on July 14, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Method and device for making integrated cooling liquid cavity i... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,182, issued on July 14, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Method for manufacturing package stru... और पढ़ें