US Patent Issued to Advanced Semiconductor Engineering on July 14 for "Method for manufacturing package structure comprising irradiating package structure by light beam" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,182, issued on July 14, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Method for manufacturing package structure comprising irradiating package structure by light beam" was invented by Tung Yao Lin (Kaohsiung, Taiwan) and Yi Dao Wang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a package structure is provided. The method includes providing a package structure including a first region and a second region different from the first region, wherein the package structure comprises a package substrate having an active surface and a backside surface; and irradiating the package ...