US Patent Issued to Semiconductor Manufacturing International (Beijing), Semiconductor Manufacturing International (Shanghai) on July 14 for "Semiconductor structure comprising sub-alignment marks" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,178, issued on July 14, was assigned to Semiconductor Manufacturing International (Beijing) Corp. (Beijing) and Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai).

"Semiconductor structure comprising sub-alignment marks" was invented by Xinxing Bai (Shanghai), Yaping Wang (Shanghai) and Chunchao Fei (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a fabrication method of the semiconductor structure are provided. The semiconductor structure includes a substrate, and the substrate includes a scribe line region. The semiconductor structure also includes a device layer over the substrate. The devi...