US Patent Issued to Teledyne e2v Semiconductors on July 14 for "Flip-chip ball grid array-type integrated circuit package for very high frequency operation" (French Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,175, issued on July 14, was assigned to Teledyne e2v Semiconductors SAS (Saint Egreve, France).

"Flip-chip ball grid array-type integrated circuit package for very high frequency operation" was invented by Olivier Legendre (Saint Egreve, France), Francois Bore (Revel, France) and Benoit Dervaux (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a flip-chip integrated circuit package of the ball array type, wherein: the underside of the package includes a plurality of receiving pads for signal, ground and solder balls; stacks of signal and ground vias, electrically connected to respective receiving pads, pass ve...