ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,092, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Apparatus for processing substrate and method of transferring substra... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,093, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for creating product-like stressed surrogate test wafers" was ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,094, issued on July 14, was assigned to INGENTEC Corp. (Miaoli County, Taiwan). "Micro-LED wafer testing device and micro-LED wafer testing... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,095, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In-situ integrated wafer parameter detection system ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,096, issued on July 14, was assigned to Korea Advanced Institute of Science and Technology (Daejeon, South Korea). "Method of manufacturing... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,098, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Multi-function etching sacrific... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,099, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method of multi-layer die stacking with die-to-wafer... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,100, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Redistribution layer metallic s... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,101, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Semiconductor device with a liner layer" was invented... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,102, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Advanced pitch interconnects with multiple l... और पढ़ें