US Patent Issued to Applied Materials on July 14 for "In-situ integrated wafer parameter detection system with remote plasma cleaning" (Singaporean, American Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,095, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"In-situ integrated wafer parameter detection system with remote plasma cleaning" was invented by Shuran Sheng (Santa Clara, Calif.), Eric Hollar (Sunnyvale, Calif.), Sock Hoon Lim (Singapore), Yu Yang (Fremont, Calif.), Ralph P. Antonio (Santa Clara, Calif.) and Gu Liu (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for monitoring wafer processing results continuously and in real-time. In some embodiments, a system may comprise at least one non-active chamber with at least one feedthrough access port which is configured to i...