US Patent Issued to Tokyo Electron on July 14 for "Method for creating product-like stressed surrogate test wafers" (New York Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,093, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Method for creating product-like stressed surrogate test wafers" was invented by Anthony R Schepis (Averill Park, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure provide a method for creating a product-like surrogate test wafer that mimic a product wafer. For example, the method can include providing a second wafer, forming a stress control layer on the second wafer, and activating the stress control layer according to a first bow measurement of a first wafer to modify an internal stress of the stress control layer such that the second wafer a...