US Patent Issued to Applied Materials on July 14 for "Method of multi-layer die stacking with die-to-wafer bonding" (Singaporean, American Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,099, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method of multi-layer die stacking with die-to-wafer bonding" was invented by Guan Huei See (Singapore), Jinho An (San Jose, Calif.) and Arvind Sundarrajan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of methods of die stacking are provided herein. In some embodiments, a method of die stacking with die-to-wafer bonding includes: bonding a plurality of first dies to a substrate via a hybrid bonding process; performing a selective silicon (Si) thinning process to reduce a thickness of the plurality of first dies that are bonded to form a plu...