ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,449, issued on July 21, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory device including source structure having conductive ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,450, issued on July 21, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Semiconductor device and fabrica... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,451, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Interconnection structure and method for manufac... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,452, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with thickening layer and m... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,453, issued on July 21, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Staircase structure in three-dimensional memo... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,454, issued on July 21, was assigned to Ampleon Netherlands B.V. (Nijmegen, Netherlands). "Electronic package and device comprising the sam... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,455, issued on July 21, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan). "Semiconductor device, semiconductor module, and s... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,456, issued on July 21, was assigned to LX SEMICON Co. LTD (Daejeon, South Korea). "Double-sided heat dissipation power semiconductor modul... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,457, issued on July 21, was assigned to 3D Glass Solutions Inc. (Albuquerque, N.M.). "Thermal transfer, management and integrated control s... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,458, issued on July 21, was assigned to Wei-Lin Chen (New Taipei City, Taiwan). "IC package with very thin vapor chamber for heat dissipati... Read More