US Patent Issued to LX SEMICON on July 21 for "Double-sided heat dissipation power semiconductor module and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,456, issued on July 21, was assigned to LX SEMICON Co. LTD (Daejeon, South Korea).

"Double-sided heat dissipation power semiconductor module and method of manufacturing the same" was invented by Tae Ryong Kim (Daejeon, South Korea) and Deog Soo Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a power semiconductor module of which heat is dissipated by its both sides and provides a power semiconductor module technology in which a mold is formed in a surrounding space of a power semiconductor die, and then, wires are formed on upper and lower sides of the power semiconductor die and substrates ...