US Patent Issued to NANYA TECHNOLOGY on July 21 for "Interconnection structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,451, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Interconnection structure and method for manufacturing the same" was invented by Zih-Hong Yang (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnection structure and a method of manufacturing an interconnection structure are provided. The interconnection structure includes a first dielectric layer, a second dielectric layer disposed on the first dielectric layer, and a first conductive layer disposed in the first dielectric layer. The interconnection structure also includes a conductive via electrically connected with the firs...