US Patent Issued to Murata Manufacturing on July 21 for "Semiconductor device, semiconductor module, and system" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,455, issued on July 21, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan).

"Semiconductor device, semiconductor module, and system" was invented by Kenji Sasaki (Nagaokakyo, Japan), Satoshi Goto (Nagaokakyo, Japan) and Masayuki Aoike (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composite board includes a first member and a second member on a first surface that is one surface of the first member. A first conductor protrusion protrudes from the second member in a direction in which the first surface faces. A second conductor protrusion protrudes from the composite board in the direction in which the first surface f...