US Patent Issued to Wei-Lin Chen on July 21 for "IC package with very thin vapor chamber for heat dissipation" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,458, issued on July 21, was assigned to Wei-Lin Chen (New Taipei City, Taiwan).

"IC package with very thin vapor chamber for heat dissipation" was invented by Wei-Lin Chen (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC package comprises a substrate; a semiconductor die with a top surface, wherein the semiconductor die is stacked over the substrate; a vapor chamber stacked over the semiconductor die, wherein the vapor chamber comprises a proximal portion and a distal portion, the proximal portion covers the top surface of the semiconductor die; and an encapsulating case encapsulating the substrate, the semiconductor die...