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US Patent Issued to National Technology & Engineering Solutions of Sandia on July 14 for "Multiaxial magnetic field-enabled underfilling" (New Mexico Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,202, issued on July 14, was assigned to National Technology & Engineering Solutions of Sandia LLC (Albuquerque, N.M.). "Multiaxial magnetic... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Bump integration with redistribution layer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,203, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Bump integration with redistributio... और पढ़ें


US Patent Issued to CHIPBOND TECHNOLOGY on July 14 for "Chip on film package with multilayer composite bumps bonded to multiple leads on a substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,204, issued on July 14, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan). "Chip on film package with multilayer composite bumps ... और पढ़ें


US Patent Issued to Nippon Micrometal, NIPPON STEEL Chemical & Material on July 14 for "AI bonding wire for semiconductor devices" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,206, issued on July 14, was assigned to Nippon Micrometal Corp. (Saitama, Japan) and NIPPON STEEL Chemical & Material Co. Ltd. (Tokyo). "AI... और पढ़ें


US Patent Issued to Nexperia on July 14 for "Semiconductor package with a cured electrically conductive paste interconnect and method for producing the same" (Dutch Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,209, issued on July 14, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Semiconductor package with a cured electrically conductive ... और पढ़ें


US Patent Issued to LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) on July 14 for "Multi-chip packaging method" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,210, issued on July 14, was assigned to LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) Co. LTD. (Kunshan City, China). "Multi-chip pac... और पढ़ें


US Patent Issued to SILICONWARE PRECISION INDUSTRIES on July 14 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,211, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufact... और पढ़ें


US Patent Issued to Mitsubishi Electric on July 14 for "Switching device electrically connected to a lead frame by a bonding material" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,212, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Switching device electrically connected to a lead frame by a bo... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package and method for manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,213, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method for manufac... और पढ़ें


US Patent Issued to Amkor Technology Singapore Holding on July 14 for "Semiconductor devices and methods of manufacturing semiconductor devices" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,214, issued on July 14, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices and methods of man... और पढ़ें