US Patent Issued to CHIPBOND TECHNOLOGY on July 14 for "Chip on film package with multilayer composite bumps bonded to multiple leads on a substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,204, issued on July 14, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Chip on film package with multilayer composite bumps bonded to multiple leads on a substrate" was invented by Sheng-Jen Wu (Hsinchu County, Taiwan), Shih-Chung Chang (Taichung City, Taiwan), Hsueh-Shun Yeh (Hsinchu County, Taiwan) and Chun-Te Lee (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A COF package includes a substrate and a chip, composite bumps on the chip are bonded to leads on the substrate. Each of the composite bumps includes a raising strip, a UBM layer and a bonding layer. A bonding rib is formed on the bonding layer because ...