US Patent Issued to Nexperia on July 14 for "Semiconductor package with a cured electrically conductive paste interconnect and method for producing the same" (Dutch Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,209, issued on July 14, was assigned to Nexperia B.V. (Nijmegen, Netherlands).

"Semiconductor package with a cured electrically conductive paste interconnect and method for producing the same" was invented by Chi Ho Leung (Nijmegen, Netherlands), Shun Tik Yeung (Nijmegen, Netherlands), King Man Tai (Nijmegen, Netherlands) and Ka Shing Martin Li (Nijmegen, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a semiconductor package includes providing a lead frame and a bond pad with a space therebetween. The frame is provided with a die bonded thereon and a die pad. The die, the pad, a part of the frame, a part of the bon...