US Patent Issued to Mitsubishi Electric on July 14 for "Switching device electrically connected to a lead frame by a bonding material" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,212, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Switching device electrically connected to a lead frame by a bonding material" was invented by Tatsuya Kawase (Tokyo) and Naoki Yoshimatsu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device reducing local increase in temperature caused by a void in a bonding material. A semiconductor device includes a conductive member, a semiconductor element, a bonding part, and a lead. The semiconductor element includes a switching element. The semiconductor element is held by the conductive member via a first bonding material. The bonding part is pro...