ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,059, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,060, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Methods of separating semiconductor dies" was invented by Michael... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,061, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Apparatus and method for removal of oxide and carbon fr... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,062, issued on July 14, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Substrate cleaning device and substrate cleaning method" was inv... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,063, issued on July 14, was assigned to EBARA Corp. (Tokyo). "Pre-wet module" was invented by Mitsutoshi Yahagi (Tokyo). According to the ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,064, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Wet processing system and nozzle for dispensing a liquid laterally ac... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,065, issued on July 14, was assigned to Yield Engineering Systems Inc. (Fremont, Calif.). "Unified rinse and dry cleaning apparatus and met... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,066, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching control system and etching control method" was invented by To... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,067, issued on July 14, was assigned to DISCO Corp. (Tokyo). "Wafer processing method and wafer processing system" was invented by Yuki Ino... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,068, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More