US Patent Issued to TEXAS INSTRUMENTS on July 14 for "Methods of separating semiconductor dies" (Texas Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,060, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Methods of separating semiconductor dies" was invented by Michael Todd Wyant (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of separating semiconductor dies are described. The method can separate individual semiconductor dies from a semiconductor wafer without using a blade. The methods include a plasma etch process utilizing metal structures formed on a back side of the wafer as masks to remove a portion of the semiconductor wafer from the back side. The portion removed by the plasma etch process corresponds to the scribe lines between the semiconductor dies. ...