ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,066, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo).
"Etching control system and etching control method" was invented by Toyohisa Tsuruda (Koshi City, Japan), Hiroshi Marumoto (Koshi City, Japan), Suguen Lee (Koshi City, Japan) and Masashi Enomoto (Koshi City, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An etching control system includes a prediction device and an etching control device. The prediction device includes an updating unit configured to update, to optimize a model indicating a relationship between distribution of an etching amount within a surface of a substrate and a process parameter, which is a parameter of co...