ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,018, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with enhancement ... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,019, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China). "Embedded packaging structure and manufact... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,020, issued on April 7, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Electronic component bonding machines, a... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,021, issued on April 7, was assigned to Altera Corp. (San Jose, Calif.). "Homogenous die stacking with increased element density" was inven... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,022, issued on April 7, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore). "Apparatus for applying a sintering force via a compressible... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,023, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,024, issued on April 7, was assigned to Wuhan Tianma Micro-Electronics Co. Ltd. (Wuhan, China) and Wuhan Tianma MicroElectronics Co. Ltd. Sh... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,025, issued on April 7, was assigned to CHIPMORE TECHNOLOGY CORPORATION LIMITED (Suzhou, China) and HEFEI CHIPMORE TECHNOLOGY Co. LTD. (Heif... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,026, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor packages with patterns of die-specific inform... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,027, issued on April 7, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan). "Electric circuit body and power conversion device" was i... और पढ़ें