ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,023, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,024, issued on April 7, was assigned to Wuhan Tianma Micro-Electronics Co. Ltd. (Wuhan, China) and Wuhan Tianma MicroElectronics Co. Ltd. Sh... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,025, issued on April 7, was assigned to CHIPMORE TECHNOLOGY CORPORATION LIMITED (Suzhou, China) and HEFEI CHIPMORE TECHNOLOGY Co. LTD. (Heif... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,026, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor packages with patterns of die-specific inform... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,027, issued on April 7, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan). "Electric circuit body and power conversion device" was i... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,028, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages having adhesive membe... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,029, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of for... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,030, issued on April 7, was assigned to Siemens AG (Munich). "Power semiconductor module system and method for producing the power semicond... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,031, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method" w... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,032, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Bilayer memory stacking with lines shared between bottom and to... और पढ़ें