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US Patent Issued to Intel on Oct. 6 for "Gate-all-around transistor circuit modification using direct contact and/or access probe points" (American, Israeli Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,776, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Gate-all-around transistor circuit modification using direct cont... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,777, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and method of fabricating... Read More


US Patent Issued to Mitsubishi Electric on Oct. 6 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,778, issued on Oct. 6, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was in... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor package including preformed support structure" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,779, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including preformed supp... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Semiconductor package with stacked dies and thermal substrate encapsulation" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,780, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package with stacked di... Read More


US Patent Issued to Intel on Oct. 6 for "Patterned sheet MUF for complex packages and methods of producing" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,781, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Patterned sheet MUF for complex packages and methods of producing... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,782, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device" was invented by Chulm... Read More


US Patent Issued to NANYA TECHNOLOGY on Oct. 6 for "Semiconductor device with slanted conductive layers and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,783, issued on Oct. 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with slanted conductive layer... Read More


US Patent Issued to Zhuhai ACCESS Semiconductor on Oct. 6 for "Package structure with wettable side surface and manufacturing method thereof, and vertical package module" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,784, issued on Oct. 6, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China). "Package structure with wettable side surfac... Read More


US Patent Issued to Ennostar on Oct. 6 for "Display device" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,785, issued on Oct. 6, was assigned to Ennostar Corp. (Hsinchu City, Taiwan). "Display device" was invented by Chih-Hao Lin (Hsinchu, Taiwan... Read More