US Patent Issued to Intel on Oct. 6 for "Patterned sheet MUF for complex packages and methods of producing" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,781, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Patterned sheet MUF for complex packages and methods of producing" was invented by Zhixin Xie (Chandler, Ariz.), Jung Kyu Han (Chandler, Ariz.) and Gang Duan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate with a die coupled to the package substrate by a plurality of interconnects. In an embodiment, a first layer is on the package substrate surrounding the die, and a second layer is over and around the die. In an embodiment, the secon...