US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Semiconductor package with stacked dies and thermal substrate encapsulation" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,780, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package with stacked dies and thermal substrate encapsulation" was invented by Yu-Hung Lin (Taichung City, Taiwan), Shih-Peng Tai (Hsinchu County, Taiwan), Kuo-Chung Yee (Taoyuan City, Taiwan), Chen-Hua Yu (Hsinchu City, Taiwan) and Wei-Ming Wang (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a first semiconductor die, a second semiconductor die, thermal silicon substrates and an encapsulation is provided. The second semiconductor die is disposed on and electrically connected to t...