US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor package including preformed support structure" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,779, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including preformed support structure" was invented by Peng Zhang (Suzhou Industrial Park, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a preformed support structure. The semiconductor package includes a substrate, the preformed support structure provided on the substrate, the preformed support structure including a first chip encapsulated with a first molding material, a plurality of second chips, at least one of the second chips being provided on the preformed support structure, an...