US Patent Issued to SEMES on May 19 for "Apparatus for treating substrate and method for treating substrate" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,444, issued on May 19, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Apparatus for treating substrate and method for tre... और पढ़ें

US Patent Issued to SILTRONIC on May 19 for "Device for drying semiconductor substrates" (German Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,445, issued on May 19, was assigned to SILTRONIC AG (Munich). "Device for drying semiconductor substrates" was invented by Sebastian Geissle... और पढ़ें

US Patent Issued to Tokyo Electron on May 19 for "Substrate processing apparatus and substrate processing method" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,446, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate processing method" was inv... और पढ़ें

US Patent Issued to SCREEN Holdings on May 19 for "Substrate treatment method and substrate treatment device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,447, issued on May 19, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treatment method and substrate treatment device" ... और पढ़ें

US Patent Issued to Tokyo Electron on May 19 for "High heat capacity hot plate" (New York Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,448, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "High heat capacity hot plate" was invented by Hoyoung Kang (Schenectady... और पढ़ें

US Patent Issued to SCREEN Holdings on May 19 for "Heat treatment apparatus" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,449, issued on May 19, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Heat treatment apparatus" was invented by Satoshi Segawa (K... और पढ़ें

US Patent Issued to Tokyo Electron on May 19 for "Substrate processing apparatus, substrate processing method and storage medium" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,450, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus, substrate processing method and storage... और पढ़ें

US Patent Issued to Beijing E-Town Semiconductor Technology, Mattson Technology on May 19 for "Support plate for localized heating in thermal processing systems" (German, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,451, issued on May 19, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc (Fremont, Calif.... और पढ़ें

US Patent Issued to JUSUNG ENGINEERING on May 19 for "Substrate processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,452, issued on May 19, was assigned to JUSUNG ENGINEERING Co. LTD. (South Korea). "Substrate processing apparatus" was invented by In Woo Ba... और पढ़ें

US Patent Issued to Tokyo Electron on May 19 for "Temperature control device, substrate processing apparatus, and liquid amount control method" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,453, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Temperature control device, substrate processing apparatus, and liquid ... और पढ़ें

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