US Patent Issued to Beijing E-Town Semiconductor Technology, Mattson Technology on May 19 for "Support plate for localized heating in thermal processing systems" (German, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,451, issued on May 19, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc (Fremont, Calif.).

"Support plate for localized heating in thermal processing systems" was invented by Rolf Bremensdorfer (Bibertal, Germany), Johannes Keppler (Palo Alto, Calif.), Michael X. Yang (Palo Alto, Calif.) and Thorsten Hulsmann (Dornstadt, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate suc...