US Patent Issued to Tokyo Electron on May 19 for "High aspect ratio contact etching with additive gas" (New York Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,434, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "High aspect ratio contact etching with additive gas" was invented by Du... और पढ़ें

US Patent Issued to Applied Materials on May 19 for "Ruthenium carbide for DRAM capacitor mold patterning" (California Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,435, issued on May 19, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Ruthenium carbide for DRAM capacitor mold patterning" ... और पढ़ें

US Patent Issued to Tokyo Electron on May 19 for "Plasma processing method and plasma processing system" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,436, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing method and plasma processing system" was invented by ... और पढ़ें

US Patent Issued to DISCO on May 19 for "Method of processing wafer using support substrate and joint member" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,437, issued on May 19, was assigned to DISCO Corp. (Tokyo). "Method of processing wafer using support substrate and joint member" was invent... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Offset data correction method and semiconductor device manufacturing method including the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,438, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Offset data correction method and semiconducto... और पढ़ें

US Patent Issued to STMicroelectronics on May 19 for "Process for manufacturing a silicon carbide semiconductor device having improved characteristics" (Italian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,439, issued on May 19, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy). "Process for manufacturing a silicon carbide semic... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Semiconductor processing tool and methods of operation" (Taiwanese, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,440, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor processing tool and met... और पढ़ें

US Patent Issued to DISCO on May 19 for "Wafer processing method" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,441, issued on May 19, was assigned to DISCO Corp. (Tokyo). "Wafer processing method" was invented by Keiichiro Niitsu (Tokyo), Youngsuk Kim... और पढ़ें

US Patent Issued to SILTRONIC on May 19 for "Method for cleaning a semiconductor wafer" (German Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,442, issued on May 19, was assigned to SILTRONIC AG (Munich). "Method for cleaning a semiconductor wafer" was invented by Damian Brock (Sank... और पढ़ें

US Patent Issued to Tokyo Electron on May 19 for "Pressure adjusting valve and semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,443, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Pressure adjusting valve and semiconductor manufacturing apparatus" was... और पढ़ें

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