US Patent Issued to DISCO on May 19 for "Method of processing wafer using support substrate and joint member" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,437, issued on May 19, was assigned to DISCO Corp. (Tokyo).

"Method of processing wafer using support substrate and joint member" was invented by Hiroshi Morikazu (Tokyo), Yuki Suto (Tokyo), Tasuku Koyanagi (Tokyo), Masato Terajima (Tokyo) and Junya Mimura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a wafer includes a composite substrate forming step of joining a face side of a wafer and a surface of a support substrate to each other with a joint member interposed therebetween, a grinding step of grinding a reverse side of the wafer of the composite substrate to thin down the wafer to a finished thickness, a transfer ...