US Patent Issued to Sandisk Technologies on June 30 for "System and method for die crack detection in wafer-to-wafer bonding" (California, Illinois Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,523, issued on June 30, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "System and method for die crack detection in wafer-t... Read More

US Patent Issued to Applied Materials on June 30 for "Hard mask stress modulation using low energy implant" (Massachusetts, California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,524, issued on June 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Hard mask stress modulation using low energy implant... Read More

US Patent Issued to GlobalWafers on June 30 for "Methods of manufacturing semiconductor-on-insulator wafers having charge trapping layers with controlled stress" (Missouri, Illinois Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,525, issued on June 30, was assigned to GlobalWafers Co. Ltd. (Hsinchu, Taiwan). "Methods of manufacturing semiconductor-on-insulator wafer... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Semiconductor device including a self-formed barrier metal layer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,527, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device including ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Method of fabricating semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,528, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Method of fabricating semiconductor devic... Read More

US Patent Issued to Zhuhai ACCESS Semiconductor on June 30 for "Manufacturing method for device embedded packaging structure" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,529, issued on June 30, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China). "Manufacturing method for device embedded p... Read More

US Patent Issued to Advanced Semiconductor Engineering on June 30 for "Electronic package" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,530, issued on June 30, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic package" was invented by H... Read More

US Patent Issued to International Business Machines on June 30 for "Transistors with via-to-backside power rail spacers" (New York, Minnesota Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,531, issued on June 30, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Transistors with via-to-backside power rail ... Read More

US Patent Issued to NANYA TECHNOLOGY on June 30 for "Contact structure, semiconductor device with the same, and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,532, issued on June 30, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Contact structure, semiconductor device with the... Read More

US Patent Issued to TOYOTA JIDOSHA on June 30 for "Vehicle mounted antenna and antenna-mounted vehicle" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,671,172, issued on June 30, was assigned to TOYOTA JIDOSHA K.K. (Aichi-ken, Japan). "Vehicle mounted antenna and antenna-mounted vehicle" was i... Read More

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