US Patent Issued to Sandisk Technologies on June 30 for "System and method for die crack detection in wafer-to-wafer bonding" (California, Illinois Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,523, issued on June 30, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"System and method for die crack detection in wafer-to-wafer bonding" was invented by Jayavel Pachamuthu (San Jose, Calif.), Kirubakaran Periyannan (Santa Clara, Calif.), Daniel J. Linnen (Naperville, Ill.) and Stephen Skala (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In wafer-to-wafer bonding, a first die is bonded to a second die at a bonding interface. Various configurations of capacitors are placed along an inner portion of an edge seal of the bonded dies to detect a discontinuity in the bonding interface. These configurations include interd...