US Patent Issued to Zhuhai ACCESS Semiconductor on June 30 for "Manufacturing method for device embedded packaging structure" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,529, issued on June 30, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Manufacturing method for device embedded packaging structure" was invented by Xianming Chen (Guangdong, China), Benxia Huang (Guangdong, China), Lei Feng (Guangdong, China), Jindong Feng (Guangdong, China) and Yejie Hong (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a device embedded packaging structure include laminating a first dielectric material on a copper foil to form a first dielectric layer, and forming a first feature pattern in the first dielectric layer to expose the copper foil, etching the expose...