US Patent Issued to Advanced Semiconductor Engineering on June 30 for "Electronic package" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,530, issued on June 30, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Electronic package" was invented by Hung-Yi Lin (Kaohsiung, Taiwan) and Cheng-Yuan Kung (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is provided. The electronic package includes a processing component and a memory unit. The processing component has a side including a first region and a second region distinct from the first region. The memory unit is disposed over the first region. The first region is configured to provide interconnection between the processing component and the memory unit, and the second r...