US Patent Issued to Industrial Technology Research Institute on June 30 for "Addition system and method of reducing agent in semiconductor manufacturing process" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,502, issued on June 30, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan). "Addition system and method of reducing... Read More

US Patent Issued to Tokyo Electron on June 30 for "Developing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,503, issued on June 30, was assigned to Tokyo Electron Ltd. (Tokyo). "Developing apparatus" was invented by Shinsuke Takaki (Kumamoto, Japa... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Substrate processing apparatus and substrate processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,504, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Substrate processing apparatus and substrate... Read More

US Patent Issued to SEMES on June 30 for "Substrate processing apparatus, operating method thereof, and photo spinner equipment" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,505, issued on June 30, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Substrate processing apparatus, operating method thereof... Read More

US Patent Issued to DISCO on June 30 for "Cutting apparatus, tray, and transport system" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,506, issued on June 30, was assigned to DISCO Corp. (Tokyo). "Cutting apparatus, tray, and transport system" was invented by Kazuma Sekiya ... Read More

US Patent Issued to Hermes-Epitek on June 30 for "Heating apparatus and pretreatment method for wafer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,507, issued on June 30, was assigned to Hermes-Epitek Corp. (Taipei City, Taiwan). "Heating apparatus and pretreatment method for wafer" wa... Read More

US Patent Issued to SHENZHEN SIPTORY TECHNOLOGY on June 30 for "Device for taking materials after cutting of encapsulated finished products based on Reuleaux polygons" (Chinese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,508, issued on June 30, was assigned to SHENZHEN SIPTORY TECHNOLOGY Co. LTD (Shenzhen, China). "Device for taking materials after cutting o... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Method of monitoring tool" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,509, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Method of monitoring tool" was inve... Read More

US Patent Issued to Daifuku on June 30 for "Transport facility" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,510, issued on June 30, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Transport facility" was invented by Daichi Tomida (Hinocho, Japan... Read More

US Patent Issued to ASM IP Holding on June 30 for "Semiconductor processing apparatus with enhanced chamber usability and the method thereof" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,511, issued on June 30, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Semiconductor processing apparatus with enhanced chambe... Read More

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