US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Substrate processing apparatus and substrate processing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,504, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus and substrate processing method using the same" was invented by Hunjae Jang (Suwon-si, South Korea) and Sangjine Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate processing apparatus including a process chamber including a process space, a stage configured to support a substrate, a rotator configured to rotate the stage, a pressurizing pump configured to increase a pressure in the process space, and a cleaning agent discharger configured to spray a cleaning agent into the proc...