ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,507, issued on June 30, was assigned to Hermes-Epitek Corp. (Taipei City, Taiwan).
"Heating apparatus and pretreatment method for wafer" was invented by Shang-Jr Gwo (New Taipei City, Taiwan) and Ching-Wen Chang (Kaohsiung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heating apparatus includes a placement surface to place a wafer and a heating unit composed of resistance-heating elements, a first conductive component, and a second conductive component. The resistance heating elements are vertically stacked and spaced apart from each other, with each being parallel to the placement surface. In addition, the resistance heating element...