US Patent Issued to SHENZHEN SIPTORY TECHNOLOGY on June 30 for "Device for taking materials after cutting of encapsulated finished products based on Reuleaux polygons" (Chinese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,508, issued on June 30, was assigned to SHENZHEN SIPTORY TECHNOLOGY Co. LTD (Shenzhen, China).

"Device for taking materials after cutting of encapsulated finished products based on Reuleaux polygons" was invented by Dongdong Shao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses a device for taking materials after cutting of encapsulated finished products based on Reuleaux polygons. A first reference track, a first carrying track, and an encapsulated finished product loading structure are arranged from bottom to top in sequence, and the distance between every two of them is constant. When the encapsulate...