US Patent Issued to Lam Research on June 30 for "Systems and methods for etching a high aspect ratio structure" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,492, issued on June 30, was assigned to Lam Research Corp. (Fremont, Calif.). "Systems and methods for etching a high aspect ratio structur... Read More

US Patent Issued to SEMES on June 30 for "Substrate processing device and substrate processing method" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,493, issued on June 30, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Substrate processing device and substrate process... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Image-based semiconductor device patterning method using deep neural network" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,494, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Image-based semiconductor device patterning ... Read More

US Patent Issued to MIKRO MESA TECHNOLOGY on June 30 for "Method of manufacturing interconnection structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,495, issued on June 30, was assigned to MIKRO MESA TECHNOLOGY Co. LTD. (Apia, Samoa). "Method of manufacturing interconnection structure" w... Read More

US Patent Issued to SKY TECH on June 30 for "Separation method of bonded substrates" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,496, issued on June 30, was assigned to SKY TECH INC. (Hsinchu County, Taiwan). "Separation method of bonded substrates" was invented by Ju... Read More

US Patent Issued to UNITED MICROELECTRONICS on June 30 for "Wafer with test structure and method of dicing wafer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,497, issued on June 30, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Wafer with test structure and method of dic... Read More

US Patent Issued to Advanced Semiconductor Engineering on June 30 for "Method of manufacturing semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,498, issued on June 30, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Method of manufacturing semiconductor... Read More

US Patent Issued to Tokyo Electron on June 30 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,499, issued on June 30, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More

US Patent Issued to SK hynix on June 30 for "Semiconductor fabrication apparatus" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,500, issued on June 30, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor fabrication apparatus" was invented by Doo... Read More

US Patent Issued to SEMES on June 30 for "Apparatus and method of treating substrate" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,501, issued on June 30, was assigned to SEMES Co. LTD. (Chungcheongnam-Do, South Korea). "Apparatus and method of treating substrate" was i... Read More

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