US Patent Issued to SKY TECH on June 30 for "Separation method of bonded substrates" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,496, issued on June 30, was assigned to SKY TECH INC. (Hsinchu County, Taiwan).

"Separation method of bonded substrates" was invented by Jung-Hua Chang (Hsinchu County, Taiwan), Jing-Cheng Lin (Hsinchu County, Taiwan) and Ta-Hao Kuo (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure is a separation method of bonded substrates. The bonded substrate is placed on a breathable plate of a debonding device to separate a wafer and a carrier substrate of the bonded substrate, and the wafer is placed on the breathable plate. A robot arm moves the wafer and the breathable plate to a cleaning device for cleaning, and then mov...