US Patent Issued to UNITED MICROELECTRONICS on June 30 for "Wafer with test structure and method of dicing wafer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,497, issued on June 30, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Wafer with test structure and method of dicing wafer" was invented by Wei-Ren Huang (Changhua County, Taiwan), Chen-Hsiao Wang (Hsinchu City, Taiwan) and Kai-Kuang Ho (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer with a test structure includes a wafer with a front side and a back side. A first die, a second die, a third die and a scribe line are disposed on the wafer. The scribe line is positioned between the dice. The first die includes a first dielectric layer and a first metal connection disposed within and on the first d...