US Patent Issued to Tokyo Electron on June 30 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,499, issued on June 30, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Akira Fujita (Koshi, Japan), Kyosei Goto (Koshi, Japan), Hiroki Aso (Koshi, Japan) and Daisuke Saiki (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes a first process of supplying an etching liquid to a peripheral portion of a substrate while rotating the substrate having a metal polycrystalline film formed on a front surface thereof; a second process of supplying a rinse liquid to a portion of the substrate closer to a center side of the substrate than...