US Patent Issued to Lawrence Livermore National Security on June 9 for "Systems and methods for silicon microstructures fabricated via greyscale DRIE with SOI release" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,976, issued on June 9, was assigned to Lawrence Livermore National Security LLC (Livermore, Calif.). "Systems and methods for silicon micros... Read More

US Patent Issued to Hitachi High-Tech on June 9 for "Etching method" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,977, issued on June 9, was assigned to Hitachi High-Tech Corp. (Tokyo). "Etching method" was invented by Kazunori Shinoda (Tokyo), Hirotaka ... Read More

US Patent Issued to DISCO on June 9 for "Device wafer processing method" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,978, issued on June 9, was assigned to DISCO Corp. (Tokyo). "Device wafer processing method" was invented by Masatoshi Wakahara (Tokyo). Ac... Read More

US Patent Issued to Tokyo Electron on June 9 for "Method for etching a layer through a patterned mask layer" (New York Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,979, issued on June 9, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for etching a layer through a patterned mask layer" was invented... Read More

US Patent Issued to Applied Materials on June 9 for "Silicon nitride damage-free dry etch method for tungsten removal in middle of line bottom-up tungsten integration" (Singaporean, American Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,980, issued on June 9, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Silicon nitride damage-free dry etch method for tungst... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 9 for "Method of fin selection for improved performance in semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,981, issued on June 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of fin selection for impro... Read More

US Patent Issued to STATS ChipPAC on June 9 for "Semiconductor manufacturing equipment and method of expelling residue through suction hood" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,982, issued on June 9, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor manufacturing equipment and method of expelling r... Read More

US Patent Issued to Ichor Systems on June 9 for "Fluid delivery module" (California, Minnesota, Texas Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,983, issued on June 9, was assigned to Ichor Systems Inc.. "Fluid delivery module" was invented by Philip Ryan Barros (Pleasanton, Calif.), ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Control of environment within processing modules" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,984, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Control of environment within process... Read More

US Patent Issued to Semes on June 9 for "Apparatus for treating substrate" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,985, issued on June 9, was assigned to Semes Co. LTD. (Cheonan-si, South Korea). "Apparatus for treating substrate" was invented by Mi So Pa... Read More

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