US Patent Issued to DISCO on June 9 for "Device wafer processing method" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,652,978, issued on June 9, was assigned to DISCO Corp. (Tokyo).

"Device wafer processing method" was invented by Masatoshi Wakahara (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device wafer processing method includes a protective film forming step of forming a protective film that covers a face side of a device wafer, a mask forming step of, after the protective film forming step is carried out, applying a laser beam along streets and forming, in the protective film, a mask that has grooves extending along the streets, a device layer plasma etching step of, after the mask forming step is carried out, performing plasma etching on a device layer...