US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Methods of forming bonding structures" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,562, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Methods of forming bonding st... Read More

US Patent Issued to Monolithic 3D on April 21 for "3D semiconductor devices and structures with functional units and pillars" (American, Israeli Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,563, issued on April 21, was assigned to Monolithic 3D Inc. (Allen, Texas). "3D semiconductor devices and structures with functional units... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Treatment of electrodes of MIM capacitors" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,564, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Treatment of electrodes of MIM ca... Read More

US Patent Issued to Intel on April 21 for "Three-dimensional interlocked corrugated capacitor structures" (Oregon, Idaho Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,565, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Three-dimensional interlocked corrugated capacitor structures... Read More

US Patent Issued to Semiconductor Manufacturing International (Shanghai) on April 21 for "Semiconductor structure and method of forming the same" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,566, issued on April 21, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai). "Semiconductor structure a... Read More

US Patent Issued to MURATA MANUFACTURING on April 21 for "Electrical device for high-voltage applications" (French Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,567, issued on April 21, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Electrical device for high-voltage applicatio... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Semiconductor device with electrode having step-shaped sidewall and method for preparing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,568, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with electrode having ste... Read More

US Patent Issued to Fast SiC Semiconductor on April 21 for "Silicon carbide semiconductor device for pinching off leakage current" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,569, issued on April 21, was assigned to Fast SiC Semiconductor Inc. (Hsinchu City, Taiwan). "Silicon carbide semiconductor device for pin... Read More

US Patent Issued to Nexperia on April 21 for "Semiconductor product and method for producing a semiconductor product" (German, Dutch Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,570, issued on April 21, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Semiconductor product and method for producing a semicond... Read More

US Patent Issued to SANKEN ELECTRIC on April 21 for "Diode, power reception device and power transmission system" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,571, issued on April 21, was assigned to SANKEN ELECTRIC Co. LTD. (Niiza, Japan). "Diode, power reception device and power transmission sy... Read More

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